SM32C6713BGDPM30EP Texas Instruments 272-BBGA

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SM32C6713BGDPM30EP
package
Tray
ICLee Shenzhen IQC laboratory — oscilloscope and component inspection before shipment
IQC · lab inspection Full QC process →
D&B D-U-N-S 687211501 — IC LEE LIMITED (Hong Kong) vendor registration
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SM32C6713BGDPM30EP

SM32C6713BGDPM30EP overview

SM32C6713BGDPM30EP Texas Instruments 272-BBGA. Key ratings: operating temperature -55°C ~ 125°C (TC).
SM32C6713BGDPM30EP

SM32C6713BGDPM30EP specifications

Type Description
Part Status Obsolete
Mounting Type Surface Mount
Type Floating Point
Operating Temperature -55°C ~ 125°C (TC)
Package / Case 272-BBGA
Supplier Device Package 272-BGA (27x27)
Interface Host Interface, I2C, McASP, McBSP
Voltage - I/O 3.30V
Clock Rate 300MHz
Non-Volatile Memory External
On-Chip RAM 264kB
Voltage - Core 1.26V

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Small batches and prototypes are welcome. Tell us your quantity—we quote realistic MOQ for SM32C6713BGDPM30EP from HK/SZ stock or sourcing. Multi-line BOMs can be quoted together.

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What inspection options do you offer for SM32C6713BGDPM30EP before payment?

ICLee is an independent distributor—not an authorized franchise. For SM32C6713BGDPM30EP (272-BBGA), before you pay we can agree IQC depth: label vs ERP, visual check, X-ray sample, or functional test when quoted. See our Quality Control page for process and real cases. Quality Control →

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