Quality Control & Incoming Inspection

Quality Control & Incoming Inspection

Quality Control & Incoming Inspection

Perfect outside. Empty inside. We catch it in Shenzhen — ICLee IQC plus approved partner labs — before you pay. Real photos, flowcharts, and QA training files below — not stock imagery.

About the images — Slides and charts are from our internal Shenzhen IQC training (Chinese labels on the files). Each section has an English summary under the image — read that for the conclusion; the photos and X-rays are the proof.

About this video — Some scenes show OK Electronica Limited, an approved partner on our memory line (e.g. baking / MSL-related steps). This is not stock footage. ICLee coordinates incoming QC and shipment release to the agreed IQC/OQC level — your quote states whether work runs at ICLee, partner lab, or both.

WhatsApp: send PN + qty + QC level

Click any photo or chart to view full size · Esc or × to close

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Empty die

X-ray: no wafer, no bond wires

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Fake labels

ERP database vs incoming carton

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Wrong date code

Label D/C ≠ body marking

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High-copy fake

Print OK · X-ray structure wrong


Stopped before your line saw it

Real intercept cases from our internal QA archive — not brochure photos. Chinese slide titles · English result below each image.

X-ray inspection empty die — package looks normal but no wafer or bond wires inside Empty die — body print passed visual · X-ray: no wafer, no bond wires

MediaTek counterfeit empty die — perfect marking but decap shows no silicon MediaTek — perfect marking · decap confirmed: no silicon inside

Micron DDR3 high-copy counterfeit — print substrate and X-ray all mismatch reference Micron high-copy — print, substrate, X-ray all wrong vs reference
Refurbished carton label compared to ICLee ERP label database by part number and date code Refurb label — incoming label vs our ERP database (PN + D/C)

Vishay date code mismatch — label shows 2323 but body marking is June 2022 Vishay D/C — label vs body marking: 1 year apart

IQC workflow — one chart

English summary: Receipt → label / pack / appearance → X-ray → electrical test → decap / solder → release or reject.

Chart below is our internal version (Chinese) — same process we run in the lab.

ICLee incoming quality control workflow chart from receipt to shipment release

Four inspection layers + part-number decode

English summary: Every lot — label · packaging · appearance · X-ray. PN suffix rules checked against manufacturer datasheets (NXP, Infineon, TI, etc.).

Training slides below are in Chinese — standard for our local IQC team; ask us for English CoC / test reports on your quote if required.

ICLee four-layer incoming inspection checklist — label packaging appearance X-ray
NXP part number suffix decode for incoming QC verification Infineon OPN orderable part number decode for authenticity check Texas Instruments label format verification against purchase order Incoming shipment compared to customer PO part number quantity and date code

Shenzhen IQC lab — 11 machines

IQC lab & warehouse · Huaqiangbei

Registered address / inspection & logistics
Room 706, Block A, Shenfang Building, No. 2001 Huaqiang North Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen, Guangdong, China

Incoming QC, re-pack, and shipment prep run here — not a walk-in sales office. Lab visits by appointment only.

Business meetings & office visits: Room 1304, Zhuoyue City, Shangmeilin, Futian — see Contact.

Our team operates these daily — X-ray, decap, LCR, programmer, metallurgical microscope, solderability, and more. Photo captions may show Chinese UI labels on equipment — the machines and results are what matter.

X-ray inspection system for die and wire bond verification Decapsulation station for die authenticity confirmation LCR meter and insulation resistance tester IC programmer for functional verification Metallurgical microscope for die surface inspection 95 percent dip solderability test equipment Digital microscope for package and marking inspection Dimension measurement for package size verification XRF analyzer for lead content and material verification Discrete component parametric tester Solvent wipe test for remarking detection

ERP label database — not guessing

Incoming cartons are compared to our reference label database by part number + date code. Typography, origin blocks, and serial formats — matched before you approve payment. This is how we catch refurbished and relabeled stock.

In-lab IQC by default — depth scales with your PN and quote

X-ray sampling, decap, solderability, or third-party report on request

CoC, FAI, or test reports available when your project requires them

Authenticity verified to the level agreed in your quote — not a one-size-fits-all slogan

ESD-safe handling · IPC/JEDEC MSL storage · ship from HK or Shenzhen after inspection

Outgoing check (OQC) — before shipment

Incoming IQC is only half the chain. Before anything leaves our hub, we run an outgoing check against your PO: quantity, part number, date code, label, and packing.

Nothing ships from HK or Shenzhen until IQC is complete and OQC is signed off to the level you requested. You approve payment after inspection — not before.

PN · qty · deadline

We reply: HK stock / SZ stock / market source · MOQ · price · inspection plan

No online checkout — send your BOM or a single PN for quote + QC plan.

WhatsApp now Submit RFQ

[email protected] · WhatsApp +86 132 4906 7145

IQC / warehouse: Room 706, Shenfang Building, 2001 Huaqiang North Road, Shenzhen