CY8C4248FNI-BL553T Infineon 76-UFBGA, WLCSP

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In-Stock:
Part Number
CY8C4248FNI-BL553T
package
Tape & Reel (TR)
Datasheet
ICLee Shenzhen IQC laboratory — oscilloscope and component inspection before shipment
IQC · lab inspection Full QC process →
D&B D-U-N-S 687211501 — IC LEE LIMITED (Hong Kong) vendor registration
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CY8C4248FNI-BL553T

CY8C4248FNI-BL553T overview

CY8C4248FNI-BL553T Infineon 76-UFBGA, WLCSP. Key ratings: operating temperature -40°C ~ 85°C (TA).
CY8C4248FNI-BL553T

CY8C4248FNI-BL553T specifications

Type Description
Part Status Active
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 76-UFBGA, WLCSP
Supplier Device Package 76-WLCSP (4.04x3.87)
Core Processor ARM® Cortex®-M0
Core Size 32-Bit
Speed 48MHz
Connectivity I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals Bluetooth, Brown-out Detect/Reset, CapSense, DMA , LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O 36
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 5.5V
Data Converters A/D 16x12b; D/A 1x7b, 1x8b
Oscillator Type Internal
Programmable Not Verified
CY8C4248FNI-BL553T

CY8C4248FNI-BL553T datasheet

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