MG51XB9AE Nuvoton 20-QFN (3x3)

In-Stock:
Part Number
MG51XB9AE
package
Tray
ICLee Shenzhen IQC laboratory — oscilloscope and component inspection before shipment
IQC · lab inspection Full QC process →
D&B D-U-N-S 687211501 — IC LEE LIMITED (Hong Kong) vendor registration
D-U-N-S® 687211501 View certificate →
MG51XB9AE

MG51XB9AE overview

MG51XB9AE Nuvoton 20-QFN (3x3). Key ratings: operating temperature -40°C ~ 105°C (TA).
MG51XB9AE

MG51XB9AE specifications

Type Description
Part Status Active
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 20-WFQFN Exposed Pad
Supplier Device Package 20-QFN (3x3)
Core Processor 8051
Core Size 8-Bit
Speed 24MHz
Connectivity I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVR, POR, PWM, WDT
Number of I/O 18
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 1K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 5.5V
Data Converters A/D 8x12b SAR
Oscillator Type Internal

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MG51XB9AE common questions

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Small batches and prototypes are welcome. Tell us your quantity—we quote realistic MOQ for MG51XB9AE from HK/SZ stock or sourcing. Multi-line BOMs can be quoted together.

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ICLee is an independent distributor—not an authorized franchise. For MG51XB9AE (20-WFQFN Exposed Pad), before you pay we can agree IQC depth: label vs ERP, visual check, X-ray sample, or functional test when quoted. See our Quality Control page for process and real cases. Quality Control →

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MG51XB9AE Nuvoton 20-QFN (3x3) — no photo
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