H9HCNNNBKUMLHR-NME HYNIX 16Gbit (2GB) LPDDR4X 200-FBGA

D-U-N-S® 687211501 Inspection on request HongKong/SZ STOCK | 24h Dispatch IQC + OQC available Secure Packing
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Part Number
H9HCNNNBKUMLHR-NME
package
FBGA
Datasheet
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H9HCNNNBKUMLHR-NME

H9HCNNNBKUMLHR-NME overview

H9HCNNNBKUMLHR-NME HYNIX 16Gbit (2GB) LPDDR4X 200-FBGA. Key ratings: supply voltage VDD1 1.8V/VDD2 1.1V/VDDQ 0.6V; operating temperature -25°C ~ +85°C (TC). Typical applications: 1. Smartphone / tablet main memory; 2. Set-top box, smart TV and IoT.
H9HCNNNBKUMLHR-NME

H9HCNNNBKUMLHR-NME specifications

Type Description
Part Status Obsolete
Grade Commercial
Qualification RoHS Compliant
Mounting Type Surface Mount
Operating Temperature -25°C ~ +85°C (TC)
Package / Case 200-FBGA
Voltage - Supply VDD1 1.8V/VDD2 1.1V/VDDQ 0.6V
Supplier Device Package 200-FBGA
Technology LPDDR4X SDRAM
Memory Type Volatile (DRAM)
Memory Format LPDDR4X
Memory Size 16Gbit (2GB)
Memory Organization x16
Memory Interface LPDDR4X
H9HCNNNBKUMLHR-NME

H9HCNNNBKUMLHR-NME features

  • 1. 16Gbit LPDDR4X SDRAM, x16, 2-channel organization
  • 2. Ultra-low power: VDD1 1.8V/VDD2 1.1V/VDDQ 0.6V
  • 3. 200-ball FBGA surface mount package
  • 4. 3733Mbps data rate
  • 5. Commercial grade -25℃ ~ +85℃
H9HCNNNBKUMLHR-NME

H9HCNNNBKUMLHR-NME applications

  • 1. Smartphone / tablet main memory
  • 2. Set-top box, smart TV and IoT
  • 3. Industrial embedded & edge computing
  • 4. Portable consumer electronics
  • 5. Legacy mobile BOM replacement
H9HCNNNBKUMLHR-NME

H9HCNNNBKUMLHR-NME datasheet

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What inspection options do you offer for H9HCNNNBKUMLHR-NME before payment?

ICLee is an independent distributor—not an authorized franchise. For H9HCNNNBKUMLHR-NME (LPDDR4X / 200-FBGA), before you pay we can agree IQC depth: label vs ERP, visual check, X-ray sample, or functional test when quoted. See our Quality Control page for process and real cases. Quality Control →

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