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H9TQ64A8GTMCUR-KUM HYNIX 64GB eMMC + 4GB LPDDR3 eMMC + LPDDR3 221-FBGA

Name: H9TQ64A8GTMCUR-KUM HYNIX 64GB eMMC + 4GB LPDDR3 eMMC + LPDDR3 221-FBGA
Brand: HYNIX
SKU: H9TQ64A8GTMCUR-KUM

D-U-N-S® 687211501 Inspection on request HongKong/SZ STOCK | 24h Dispatch IQC + OQC available Secure Packing

Manufacturer

HYNIX

In-Stock:

10000

Part Number

H9TQ64A8GTMCUR-KUM

package

FBGA

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IQC · lab inspection Full QC process →

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ISO 9001 Vendor docs →

H9TQ64A8GTMCUR-KUM

H9TQ64A8GTMCUR-KUM overview

H9TQ64A8GTMCUR-KUM HYNIX 64GB eMMC + 4GB LPDDR3 eMMC + LPDDR3 221-FBGA. Key ratings: supply voltage VDD1 1.8V/VDD2 1.2V/VDDQ 1.2V; operating temperature -25℃ ~ +85℃ (TC). Typical applications: 1. Smartphone & tablet main memory+storage; 2. Legacy handheld embedded system.

H9TQ64A8GTMCUR-KUM

H9TQ64A8GTMCUR-KUM specifications

Type	Description
Part Status	Obsolete
Grade	Commercial
Qualification	RoHS Compliant
Mounting Type	Surface Mount
Operating Temperature	-25℃ ~ +85℃ (TC)
Package / Case	221-FBGA
Voltage - Supply	VDD1 1.8V/VDD2 1.2V/VDDQ 1.2V
Supplier Device Package	221-FBGA
Technology	eMMC + LPDDR3
Memory Type	Non-Volatile (Flash)+Volatile (DRAM)
Memory Format	eMCP
Memory Size	64GB eMMC + 4GB LPDDR3
Memory Organization	Combined NAND+DRAM
Memory Interface	eMCP

H9TQ64A8GTMCUR-KUM

H9TQ64A8GTMCUR-KUM features

1. eMCP stacked combo package integrating eMMC NAND flash + LPDDR3 DRAM
2. Single 221-ball FBGA saves PCB space for mobile devices
3. 64GB storage +4GB memory integrated in one chip
4. Low voltage design optimized for handheld equipment 5. Commercial grade -25℃ ~ +85℃ operating range

H9TQ64A8GTMCUR-KUM

H9TQ64A8GTMCUR-KUM applications

1. Smartphone & tablet main memory+storage
2. Legacy handheld embedded system
3. Portable medical equipment
4. IoT handheld terminal 5. Old BOM replacement & repair

H9TQ64A8GTMCUR-KUM alternatives

H9HP16AECMMDAR-KMM Description MCP-EMCP-128+6 Package FBGA

H9HP52ACPMMDAR-KMM Description MCP-EMCP-64+4 Package FBGA

H9TQ17ABJTBCUR-KUM Description MCP-EMCP-16+2 Package FBGA

H9TQ17ABJTCCUR-KUM Description MCP-EMCP-16+2 Package FBGA

KMQE60013M-B318 Description Estorage Density: 16 GB Estorage Version: eMMC 5.1 Dram Density: 16 Gb Dram Type: LPDDR3 Package: 221 FBGA Speed: 1866Mbps Production Status: EOL Package 221 FBGA

KMQE60013B-B318 Description Estorage Density: 16 GB Estorage Version: eMMC 5.1 Dram Density: 16 Gb Dram Type: LPDDR3 Package: 221 FBGA Speed: 1866Mbps Production Status: Mass Production Package 221 FBGA

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What is the MOQ for H9TQ64A8GTMCUR-KUM?

Small batches and prototypes are welcome. Tell us your quantity—we quote realistic MOQ for H9TQ64A8GTMCUR-KUM from HK/SZ stock or sourcing. Multi-line BOMs can be quoted together.

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We show 10000 pcs available for H9TQ64A8GTMCUR-KUM. After order confirmation, HK/SZ hub dispatch is typically within 24–48 hours; international express transit is additional.

What inspection options do you offer for H9TQ64A8GTMCUR-KUM before payment?

ICLee is an independent distributor—not an authorized franchise. For H9TQ64A8GTMCUR-KUM (eMCP / 221-FBGA), before you pay we can agree IQC depth: label vs ERP, visual check, X-ray sample, or functional test when quoted. See our Quality Control page for process and real cases. Quality Control →

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We partner with DHL, FedEx, and UPS for reliable air express; sea freight is available on request. Shipping options and costs for H9TQ64A8GTMCUR-KUM are listed on your formal quote—not at online checkout. For in-stock lines from our HK/SZ hubs, we typically ship within 24–48 hours after order confirmation. Shipping & Delivering →

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