HN8T174EJKX075R HYNIX 256GB FLASH 153-FBGA

D-U-N-S® 687211501 Inspection on request HongKong/SZ STOCK | 24h Dispatch IQC + OQC available Secure Packing
Manufacturer
In-Stock:
Part Number
HN8T174EJKX075R
package
FBGA
Datasheet
ICLee Shenzhen IQC laboratory — oscilloscope and component inspection before shipment
IQC · lab inspection Full QC process →
D&B D-U-N-S 687211501 — IC LEE LIMITED (Hong Kong) vendor registration
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HN8T174EJKX075R

HN8T174EJKX075R overview

HN8T174EJKX075R HYNIX 256GB FLASH 153-FBGA. Key ratings: supply voltage 2.5V / 1.2V; operating temperature -25°C ~ 85°C.
HN8T174EJKX075R

HN8T174EJKX075R specifications

Type Description
Part Status Active
Grade Consumer
Qualification RoHS Compliant
Mounting Type Surface Mount
Operating Temperature -25°C ~ 85°C
Package / Case 153-FBGA
Voltage - Supply 2.5V / 1.2V
Supplier Device Package 153-BGA (11.0x13.0x0.8mm)
Technology FLASH - NAND (TLC)
Memory Type Non-Volatile
Memory Format FLASH
Memory Size 256GB
Memory Organization UFS 4.0
Memory Interface UFS 4.0
HN8T174EJKX075R

HN8T174EJKX075R datasheet

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Small batches and prototypes are welcome. Tell us your quantity—we quote realistic MOQ for HN8T174EJKX075R from HK/SZ stock or sourcing. Multi-line BOMs can be quoted together.

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We show 10000 pcs available for HN8T174EJKX075R. After order confirmation, HK/SZ hub dispatch is typically within 24–48 hours; international express transit is additional.

What inspection options do you offer for HN8T174EJKX075R before payment?

ICLee is an independent distributor—not an authorized franchise. For HN8T174EJKX075R (UFS 4.0 / 153-FBGA), before you pay we can agree IQC depth: label vs ERP, visual check, X-ray sample, or functional test when quoted. See our Quality Control page for process and real cases. Quality Control →

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HN8T174EJKX075R HYNIX 256GB FLASH 153-FBGA — no photo
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