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K3LK3K30EM-BGCN Samsung 16Gb (2GB) LPDDR5 315-FBGA

Name: K3LK3K30EM-BGCN Samsung 16Gb (2GB) LPDDR5 315-FBGA
Brand: Samsung
SKU: K3LK3K30EM-BGCN

D-U-N-S® 687211501 Inspection on request HongKong/SZ STOCK | 24h Dispatch IQC + OQC available Secure Packing

Manufacturer

Samsung

In-Stock:

1120

Part Number

K3LK3K30EM-BGCN

package

496 FBGA

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IQC · lab inspection Full QC process →

D-U-N-S® 687211501 View certificate →

ISO 9001 Vendor docs →

K3LK3K30EM-BGCN

K3LK3K30EM-BGCN overview

capacity: 64 Gb Architecture: x64 Speed: 5500 Mbps Package: 496 FBGA Production Status: EOL

K3LK3K30EM-BGCN

K3LK3K30EM-BGCN specifications

Type	Description
Part Status	Active
Grade	Commercial
Qualification	RoHS Compliant
Mounting Type	Surface Mount
Operating Temperature	-25℃ ~ +85℃
Package / Case	315-FBGA
Voltage - Supply	VDD1 1.8V/VDD2 1.05V/VDDQ 0.5V
Supplier Device Package	315-FBGA
Technology	LPDDR5 SDRAM
Memory Type	Volatile (DRAM)
Memory Format	LPDDR5
Memory Size	16Gb (2GB)
Memory Organization	x16
Memory Interface	LPDDR5
Clock Frequency	6400Mbps

K3LK3K30EM-BGCN

K3LK3K30EM-BGCN features

1. 16Gb LPDDR5 SDRAM, x16, 6400Mbps data rate
2. Ultra low power multi-rail voltage
3. 315-ball FBGA package
4. High bandwidth for mobile AI processing
5. Commercial grade -25~+85℃

K3LK3K30EM-BGCN

K3LK3K30EM-BGCN applications

1. Smartphone main memory
2. Portable embedded AI board
3. Smart wearable devices
4. High-speed IoT terminal
5. Handheld consumer electronics

K3LK3K30EM-BGCN alternatives

H9JKNNNFB3AECR-N6H Description ddr-lpddr5-496-8GB Package FBGA

KMQE60013M-B318 Description Estorage Density: 16 GB Estorage Version: eMMC 5.1 Dram Density: 16 Gb Dram Type: LPDDR3 Package: 221 FBGA Speed: 1866Mbps Production Status: EOL Package 221 FBGA

KMQE60013B-B318 Description Estorage Density: 16 GB Estorage Version: eMMC 5.1 Dram Density: 16 Gb Dram Type: LPDDR3 Package: 221 FBGA Speed: 1866Mbps Production Status: Mass Production Package 221 FBGA

KMGX6001BA-B514 Description Estorage Density: 32 GB Estorage Version: eMMC 5.1 Dram Density: 24 Gb Dram Type: LPDDR3 Package: 221 FBGA Speed: 1866Mbps Production Status: Mass Production Package 221 FBGA

KMFN60012B-B214 Description Estorage Density: 8 GB Estorage Version: eMMC 5.1 Dram Density: 8 Gb Dram Type: LPDDR3 Package: 221 FBGA Speed: 1866Mbps Production Status: Mass Production Package 221 FBGA

KMDP6001DA-B425 Description Estorage Density: 64 GB Estorage Version: eMMC 5.1 Dram Density: 32 Gb Dram Type: LPDDR4X Package: 254 FBGA Speed: 4266Mbps Production Status: Mass Production Package 254 FBGA

KM2L9001CM-B518 Description Estorage Density: 128 GB Estorage Version: UFS2.2 Dram Density: 48 Gb Dram Type: LPDDR4X Package: 254 FBGA Speed: 4266Mbps Production Status: Mass Production Package 254 FBGA

K3LK7K70BM-BGCP Description capacity: 64 Gb Architecture: x64 Speed: 6400 Mbps Package: 496 FBGA Production Status: Mass Production Package 496 FBGA

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Small batches and prototypes are welcome. Tell us your quantity—we quote realistic MOQ for K3LK3K30EM-BGCN from HK/SZ stock or sourcing. Multi-line BOMs can be quoted together.

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We show 1120 pcs available for K3LK3K30EM-BGCN. After order confirmation, HK/SZ hub dispatch is typically within 24–48 hours; international express transit is additional.

What inspection options do you offer for K3LK3K30EM-BGCN before payment?

ICLee is an independent distributor—not an authorized franchise. For K3LK3K30EM-BGCN (LPDDR5 / 315-FBGA), before you pay we can agree IQC depth: label vs ERP, visual check, X-ray sample, or functional test when quoted. See our Quality Control page for process and real cases. Quality Control →

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