eMMC Part Number Decoder: Samsung KLM vs Micron MTFC — IClee

eMMC Part Number Decoder: Samsung KLM vs Micron MTFC — IClee

2026-08-04

eMMC Part Number Decoder: Samsung KLM vs Micron MTFC

Samsung KLM, Micron MTFC, SK Hynix H26M — each has its own cryptic naming logic. One wrong letter in the suffix can mean a different ball grid, temperature grade, or firmware revision your host controller won't recognize. This guide breaks down the two most common eMMC families in independent distribution so you know exactly what you're ordering.


eMMC memory chip BGA package on dark surface — Samsung KLM and Micron MTFC eMMC ICs

1. Why eMMC part numbers drive everyone crazy
If you've ever tried to cross-reference an eMMC chip, you know the pain. Samsung uses KLM, Micron uses MTFC, SK Hynix uses H26M — and each has its own naming logic that reads like a cipher. Worse, the suffix digits (like -B041 vs -B001) can encode entirely different ball grid arrays, making the same "KLM8G1GETF" physically incompatible with your PCB.

2. Samsung eMMC: KLM series decoder
Samsung's eMMC naming is actually logical once you know the formula. Let's decode KLM8G1GETF-B041:

KLM  8  G  1  G  E  T  F  -  B041
│    │  │  │  │  │  │  │     └──── Customer/Revision code
│    │  │  │  │  │  │  └────────── Package type
│    │  │  │  │  │  └───────────── Generation/Version
│    │  │  │  │  └──────────────── Flash type (E = eMMC 5.0 / 5.1)
│    │  │  │  └─────────────────── Controller version
│    │  │  └────────────────────── Density unit (G = GB)
│    │  └───────────────────────── Density value
│    └──────────────────────────── Product line (KLM = eMMC, KLU = UFS)
└────────────────────────────────── Samsung Memory

3. Samsung eMMC density codes

Code Capacity Example Part
KLM4G 4 GB KLM4G1FETE-B041
KLM8G 8 GB KLM8G1GETF-B041
KLMAG 16 GB KLMAG1JENB-B041
KLMBG 32 GB KLMBG4JENB-B041

4. Samsung eMMC temperature grades

Suffix Pattern Temperature Range Grade
-B041, -B001 -25°C ~ +85°C Consumer / Industrial
-C041, -C001 -40°C ~ +85°C Industrial wide-temp (less common, harder to source)

Critical: Samsung uses the same base part number (e.g., KLM8G1GETF) across different PCB ball grids: B041 = 153-ball FBGA, B001 = 169-ball FBGA. These are not interchangeable — always verify the complete suffix when cross-referencing.

5. Samsung eMMC generation map

Family Standard Max Speed (HS400) Key Feature
KLMxG1FE (v4.x) eMMC 4.5 200 MB/s Legacy, EOL risk
KLMxG1GE (v5.0) eMMC 5.0 400 MB/s Most common in distribution
KLMAG1JE (v5.1) eMMC 5.1 400 MB/s CMD queue, higher IOPS
KLMBG4JE (v5.1) eMMC 5.1 400 MB/s 32 GB+ densities

6. Micron eMMC: MTFC series decoder
Now let's decode MTFC16GAPALBH-IT:

MTFC  16  G  A  P  A  L  B  H  -  IT
│     │   │  │  │  │  │  │  │      └── Temperature: IT = Industrial (-40~85°C)
│     │   │  │  │  │  │  │  └───────── Revision
│     │   │  │  │  │  │  └──────────── Package material (B = BGA Pb-free)
│     │   │  │  │  │  └─────────────── Voltage (L = VCC 3.3V + VCCQ 1.8V/3.3V)
│     │   │  │  │  └────────────────── Feature set (A = Standard, G = enhanced)
│     │   │  │  └───────────────────── NAND type (P = MLC, G = TLC)
│     │   │  └──────────────────────── Generation/Die revision
│     │   └─────────────────────────── Density unit (G = GB)
│     └─────────────────────────────── Product: MTFC = eMMC
└────────────────────────────────────── Micron

7. Micron eMMC density codes

Code Capacity Example Part
MTFC4G 4 GB MTFC4GACAJCN-1M WT
MTFC8G 8 GB MTFC8GAMALBH-AAT
MTFC16G 16 GB MTFC16GAPALBH-IT
MTFC32G 32 GB MTFC32GAKAECN-2M WT
MTFC64G 64 GB MTFC64GAPAKEA-IT
MTFC128G 128 GB MTFC128GAJAEDN-AIT

8. Micron temperature grades (more explicit than Samsung)

Suffix Temp Range Target Market
-AAT / -AIT -40°C ~ +105°C Automotive AEC-Q100
-IT -40°C ~ +85°C Industrial
-WT / -M WT -25°C ~ +85°C Consumer / Commercial

Micron marks temperature grade explicitly in the suffix, which makes cross-referencing much easier than Samsung's cryptic customer codes. When you see -IT, you know it's guaranteed for -40°C ~ +85°C.

9. Cross-reference: Samsung KLM ↔ Micron MTFC
Need a form-fit-function equivalent? Here's a quick map for the most common densities you'll find in the open market:

Density Samsung Micron Ball Count Ball-Grid
4 GB KLM4G1FETE-B041 MTFC4GACAJCN-1M WT 153 / 169 11.5×13 mm
8 GB KLM8G1GETF-B041 MTFC8GAMALBH-AAT 153 11.5×13 mm
16 GB KLMAG1JENB-B041 MTFC16GAPALBH-IT 153 11.5×13 mm

Warning: These are NOT drop-in replacements. PCB ball map, VCCQ voltage levels, and initialization sequence may differ. Always check the datasheet or do a board-level qualification before swapping.

10. 3 common mistakes when buying eMMC on the open market

1. Ignoring the suffix
Samsung's -B041 vs -B001 vs -B041-00 are all physically different chips with different ball grid arrays. An incorrect suffix means your chip won't fit the PCB footprint — even if the base part number is the same.

2. Assuming all "IT" Micron parts are the same
Micron MTFC8GAMALBH-AAT (Automotive -40~105°C) and MTFC8GAMALBH-IT (Industrial -40~85°C) are different SKUs with very different pricing. Automotive-grade is typically 30-50% more expensive.

3. Confusing eMMC 5.0 with eMMC 5.1
Samsung eMMC 5.0 (KLMxG1GE) and 5.1 (KLMAG1JE) share the same ball grid in some densities, but 5.1 adds Command Queuing and higher random read IOPS. If your host controller expects eMMC 5.1 features, a 5.0 part may function but with degraded performance.

11. Source eMMC at IClee — decode once, order right
We stock Samsung KLM and Micron MTFC eMMC in our Hong Kong warehouse. Every chip is visually inspected (IQC), batch-verified for ball grid integrity, and shipped in ESD-safe packaging. We include the full suffix in every listing so you know exactly what you're getting — no guesswork.

Send PN (with full suffix) + qty + target date code. We reply with HK stock status, MOQ, price, and ship path in ~24 business hours. Cross-reference requests welcome — include both your original PN and the alternate you want us to check.

New to sourcing memory ICs through independent distribution? See our Quality Control page for IQC/X-ray procedures, or read How Independent Distributors Verify Electronic Components for the full verification framework.

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