SK Hynix DRAM Selection Guide

We stock commercial and industrial grade SK Hynix DRAM chips, supporting embedded boards, HMI displays, edge computing hardware, field data acquisition gateways, IPC cameras and legacy equipment repair projects. Decoding the part number helps you pick the correct DRAM and avoid costly replacement mistakes.

1. DRAM Generation & Voltage

H5T = DDR3

• H5TC: DDR3L, 1.35V low voltage, built for battery-powered low-power equipment
• H5TQ: Standard DDR3 at 1.5V, suited for devices with external power supply

DDR3 Speed Bin Reference: G7=1066MT/s, H9=1333MT/s, PB=1600MT/s, RD=1866MT/s, TE=2133MT/s

DDR3 Package Note:
Package ball count cannot be directly decoded by the middle 3‑letter code. Always cross‑check datasheet to confirm FBGA‑78 or FBGA‑96 ball count. standard package with better thermal performance

H5A / H5AN = DDR4, fixed voltage at 1.2V DDR4 Speed Bin Reference: TF=2133MT/s, UH=2400MT/s, VK=2666MT/s, XN=3200MT/s

Important Note for DDR4:

• 3 trailing digits indicate package: 116=FBGA78ball, 017=FBGA96ball
• Codes like JR / FR / DR mark die and substrate revisions only. You will need to check the datasheet to confirm ball count.

H5C = DDR5, 1.1V, mostly deployed on servers and AI modules.

2. Data Width (Not Interchangeable)

• x4: Industrial communication boards and industrial servers, usually used in parallel multi-chip designs
• x8: Industrial motherboards, edge boxes — widely adopted across embedded projects
• x16: HMI screens, SSD cache, IPC cameras

3. Operating Temperature Grade

• C / D / A: Commercial Grade, 0℃ ~ +95℃. For indoor applications only, not suitable for sub-zero environments.
• I: Industrial Grade, -40℃ ~ +95℃. Commonly used on outdoor gateways and field controllers.
• K: Automotive Grade, -40℃ ~ +105℃. Designed for automotive front-end use, stock is limited.

Key reminder: Industrial Grade I is NOT equivalent to AEC-Q100 automotive certification.

4. Capacity Conversion

Part numbers list capacity in Gb (Gigabit), while most BOMs use GB (Gigabyte). Calculation: Gb ÷ 8 = GB Examples: 8Gb =1GB; 4Gb=512MB; 2Gb=256MB

5. Step-by-step Selection Workflow

1. Confirm your device’s operating temperature range
2. For DDR3: verify supply voltage; DDR4 runs on fixed 1.2V
3. Confirm required memory capacity
4. Confirm required data width (x4/x8/x16)
5. Check the maximum speed supported by your host controller
6. Confirm FBGA ball count based on your PCB layout

6. Common Pitfalls to Watch

• DDR3L (1.35V) can tolerate 1.5V supply, but standard 1.5V DDR3 cannot run at 1.35V.
• Different ball counts mean different PCB footprints; direct replacement is not possible.
• Commercial grade chips cannot work below 0°C. Choose I industrial grade for cold environments.
• DDR4 suffix codes JR / FR cannot tell you the package ball count; always cross-check the datasheet.

7. Typical Applications

Industrial motherboards, HMI touchscreens, security IPC, outdoor field gateways, legacy equipment BOM and EOL component replacement.

sample:
H5AG48DXNDX116N
DDR4 / 16Gb / x8 / 3200MT/s / FBGA‑78, Commercial grade 0‑85℃


Send over your target part number or full BOM list. We can verify specs and provide quotation.