MSC8122TMP6400V NXP USA 431-BFBGA, FCBGA

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Part Number
MSC8122TMP6400V
package
Tray
Datasheet
ICLee Shenzhen IQC laboratory — oscilloscope and component inspection before shipment
IQC · lab inspection Full QC process →
D&B D-U-N-S 687211501 — IC LEE LIMITED (Hong Kong) vendor registration
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MSC8122TMP6400V

MSC8122TMP6400V overview

MSC8122TMP6400V NXP USA 431-BFBGA, FCBGA. Key ratings: operating temperature -40°C ~ 105°C (TJ).
MSC8122TMP6400V

MSC8122TMP6400V specifications

Type Description
Part Status Obsolete
Mounting Type Surface Mount
Type SC140 Core
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 431-BFBGA, FCBGA
Supplier Device Package 431-FCPBGA (20x20)
Interface DSI, Ethernet, RS-232
Voltage - I/O 3.30V
Clock Rate 400MHz
Non-Volatile Memory External
On-Chip RAM 1.436MB
Voltage - Core 1.10V
MSC8122TMP6400V

MSC8122TMP6400V datasheet

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Small batches and prototypes are welcome. Tell us your quantity—we quote realistic MOQ for MSC8122TMP6400V from HK/SZ stock or sourcing. Multi-line BOMs can be quoted together.

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MSC8122TMP6400V NXP USA 431-BFBGA, FCBGA, top view
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