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SPC5775BSK3MME2 NXP USA 416-BGA

Name: SPC5775BSK3MME2 NXP USA 416-BGA
Brand: NXP USA Inc.
SKU: SPC5775BSK3MME2

Manufacturer

NXP USA Inc.

In-Stock:

Available on quote

Part Number

SPC5775BSK3MME2

package

Tray

Datasheet

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SPC5775BSK3MME2

SPC5775BSK3MME2 overview

SPC5775BSK3MME2 NXP USA 416-BGA. Key ratings: operating temperature -40°C ~ 125°C (TA).

SPC5775BSK3MME2

SPC5775BSK3MME2 specifications

Type	Description
Part Status	Active
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 125°C (TA)
Package / Case	416-BGA
Supplier Device Package	416-MAPBGA (27x27)
Core Processor	e200z7
Core Size	32-Bit Dual-Core
Speed	220MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	-
Oscillator Type	External

SPC5775BSK3MME2

SPC5775BSK3MME2 datasheet

Download

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