SPC5777CSK3MME4 NXP USA 416-BGA

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SPC5777CSK3MME4
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Tray
Datasheet
ICLee Shenzhen IQC laboratory — oscilloscope and component inspection before shipment
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SPC5777CSK3MME4

SPC5777CSK3MME4 overview

SPC5777CSK3MME4 NXP USA 416-BGA. Key ratings: operating temperature -40°C ~ 125°C (TA).
SPC5777CSK3MME4

SPC5777CSK3MME4 specifications

Type Description
Part Status Active
Grade Automotive
Qualification AEC-Q100
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TA)
Package / Case 416-BGA
Supplier Device Package 416-MAPBGA (27x27)
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 300MHz
Connectivity CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals DMA, LVD, POR, Zipwire
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 10x16b Sigma-Delta, eQADC
Oscillator Type External, Internal
SPC5777CSK3MME4

SPC5777CSK3MME4 datasheet

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